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description these high intensity white led lamps are based on ingan material technology. a blue led die is coated by a phosphor to produce white. the typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 cie chromaticity diagram. these t-1 3 ? 4 lamps are untinted, nondiffused, and incorporate precise optics producing well defined spatial radiation patterns at specific viewing cone angle. hlmp-cw15, hlmp-cw16, hlmp-cw23, hlmp-cw24, hlmp-cw30, hlmp-cw31, hlmp-cw70, hlmp-cw72 features ? highly luminous white emission ? 15 , 23 , 30 , and 70 viewing angle applications ? electronic signs and signals ? small area illumination ? legend backlighting ? general purpose indicators benefit ? reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources hlmp-cwxx t-1 3 / 4 precision optical performance w hite led lamps data sheet caution: these devices are class 1c esd sensitive. please observe appropriate precautions during handling and processing. refer to avago technologies application note an-1142 for additional details.
2 device selection guide min. luminous intensity viewing angle iv (mcd) @ 20 ma part number typ. min. max. standoff leads package dimension hlmp-cw15-tw0xx 15 2500 7200 no a hlmp-cw15-tw0xx 15 2500 7200 no a hlmp-cw15-uv0xx 15 3200 5500 no a hlmp-cw15-vwbxx 15 4200 7200 no a hlmp-cw15-vy0xx 15 4200 12000 no a hlmp-cw15-vybxx 15 4200 12000 no a hlmp-cw15-vygxx 15 4200 12000 no a hlmp-cw15-vykxx 15 4200 12000 no a hlmp-cw16-r00xx 15 1500 - yes b hlmp-cw16-tw0xx 15 2500 7200 yes b hlmp-cw16-vy0xx 15 4200 12000 yes b hlmp-cw23-sv0xx 23 1900 5500 no a hlmp-cw23-svkxx 23 1900 5500 no a hlmp-cw23-tw0xx 23 2500 7200 no a hlmp-cw24-sv0xx 23 1900 5500 yes b hlmp-cw24-tw0xx 23 2500 7200 yes b hlmp-cw30-ps0xx 30 880 2500 no a hlmp-cw30-ru0xx 30 1500 4200 no a hlmp-cw30-stbxx 30 1900 3200 no a HLMP-CW30-SV0XX 30 1900 5500 no a hlmp-cw31-m00xx 30 520 - yes b hlmp-cw31-ps0xx 30 880 2500 yes b hlmp-cw31-sv0xx 30 1900 5500 yes b hlmp-cw70-lmbxx 70 o 400 680 no a hlmp-cw70-lp0xx 70 o 400 1150 no a hlmp-cw72-lp0xx 70 o 400 1150 yes b tolerance for each intensity limit is 15%.
3 package dimensions 1.14 ?0.20 (0.045 ?0.008) 5.80 ?0.20 (0.228 ?0.008) 5.00 ?0.20 (0.197 ?0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 ?0.20 (0.343 ?0.008) 2.54 ?0.38 (0.100 ?0.015) 0.50 ?0.10 (0.020 ?0.004) sq. typ. cathode lead cathode flat d 1.50 ?0.15 (0.059 ?0.006) package dimension b 1.14 ?0.20 (0.045 ?0.008) 5.80 ?0.20 (0.228 ?0.008) 5.00 ?0.20 (0.197 ?0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 ?0.20 (0.343 ?0.008) 2.54 ?0.38 (0.100 ?0.015) 0.50 ?0.10 (0.020 ?0.004) sq. typ. notes: 1. all dimensions are in millimeters (inches). 2. epoxy meniscus may extend about 1 mm (0.040") down the leads. cathode lead 2.35 (0.093) max. cathode flat package dimension a hlmp-cw24 d = 12.52 ?0.25 (0.493 ?0.010) hlmp-cw16 d = 12.6 ?0.25 (0.496 ?0.010) hlmp-cw31 d = 11.96 ?0.25 (0.471 ?0.010) hlmp-cw72 d = 12.52 ?0.25 (0.493 ?0.010)
4 part numbering system hlmp cwxx - x x x xx mechanical option 00: bulk dd: ammo pack color bin option 0: full color bin distribution b: color bins 2 & 3 g: color bins 2, 3 & 4 k: color bins 2 & 4 maximum intensity bin limit 0: no maximum intensity bin limit others: refer to device selection guide minimum intensity bin limit refer to device selection guide viewing angle and standoff option 15: 15 without standoffs 16: 15 with standoffs 23: 23 without standoffs 24: 23 with standoffs 30: 30 without standoffs 31: 30 with standoffs 70: 50 without standoffs 72: 50 with standoffs
5 absolute maximum ratings t a = 25 ? c parameter value units dc forward current [1] 30 ma peak forward current [2] 100 ma power dissipation 111 mw reverse voltage (i r = 10 a) 5 v led junction temperature 110 o c operating temperature range C 40 to +80 o c storage temperature range C 40 to +100 o c notes: 1. derate linearly as shown in figure 5. 2. duty factor 10%, 1 khz. electrical characteristics t a = 25 c forward voltage, reverse breakdown, capacitance, c (pf), thermal resistance v f (v) @ i f = 20 ma v r (v) @ i r = 10 av f = 0, f = 1 mhz r j-pin ( c/w) typ. max. min. typ. typ. 3.2 3.7 5 70 240 optical characteristics t a = 25 c typical chromaticity viewing angle coordinates [1] 2 1/2 degrees [2] part number x y typ. hlmp-cw3x-xxxxx 0.32 0.32 30 hlmp-cw2x-xxxxx 0.32 0.32 23 hlmp-cw1x-xxxxx 0.32 0.32 15 hlmp-cw7x-xxxxx 0.32 0.32 50 notes: 1. the chromaticity coordinates are derived from the cie 1931 chromaticity diagram and represent the perceived color of the dev ice. 2. 1/2 is the off-axis angle where the luminous intensity is 1 ? 2 the peak intensity.
6 figure 6a. cw1x spatial radiation pattern figure 1. relative intensity vs. wavelength figure 3. relative lv vs. forward current figure 5. maximum forward current vs. temperature figure 4. chromaticity shift vs. current wavelength ?nm relative luminous intensity 380 780 1.0 0.6 0 680 580 480 0.4 0.8 0.2 figure 2. forward current vs. forward voltage 0 1.5 0.3 relative luminous intensity forward current ?ma 030 1.2 10 20 0.9 0.6 relative intensity 1 0 angular displacement ?degrees 0.5 -90 -60 0 -30 30 60 90 -0.010 0.025 0 0.005 -0.005 y-coordinates x-coordinates (x,y) values @ 20 ma reference to (0,0) -0.004 0.004 -0.002 30 ma 5 ma 1 ma 0 0.002 0.015 0.010 0.020 25 ma 20 ma 15 ma 10 ma forward current ?ma 0 0 forward voltage ?v 20 15 2 35 30 5 10 25 134 i f max. ?maximum forward current ?ma 0 0 t a ?ambient temperature ? c 40 80 35 30 10 20 60 100 15 25 5 20
7 figure 6b. cw2x spatial radiation pattern relative luminous intensity 1 0 angular displacement ?degrees 0.5 -90 -60 0 -30 30 60 90 figure 6c. cw3x spatial radiation pattern relative luminous intensity 1 0 angular displacement ?degrees 0.5 -90 -60 0 -30 30 60 90 figure 6c. cw7x spatial radiation pattern relative luminous intensity 1 0 angular displacement ?degrees 0.5 -90 -60 0 -30 30 60 90
8 intensity bin limits (mcd at 20 ma) bin min. max. l 400 520 m 520 680 n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 tolerance for each bin limit is 15%. color bin limit table rank limits (chromaticity coordinates) 1x 0.330 0.330 0.356 0.361 y 0.360 0.318 0.351 0.385 2x 0.287 0.296 0.330 0.330 y 0.295 0.276 0.318 0.339 3x 0.264 0.280 0.296 0.283 y 0.267 0.248 0.276 0.305 4x 0.283 0.287 0.330 0.330 y 0.305 0.295 0.339 0.360 tolerance for each bin limit is 0.01. 0.40 0.35 0.30 0.25 0.20 0.26 0.30 0.34 0.38 y-coordinate x-coordinate 3 2 4 1 black body curve color bin limits with respect to cie 1931 chromaticity diagram note: bin categories are established for classification of products. products may not be available in all bin categories. please contact your avago representative for information on currently available bins. 0 1.2 1.0 relative light output (normalized at t j = 25 c) t j ?junction temperature ? c -40 1.4 0.8 -20 0 20 40 60 120 80 100 0.2 0.4 0.6 relative light output vs. junction temperature
9 ? if necessary, use fixture to hold the led component in proper orientation with respect to the pcb during soldering process. ? at elevated temperature, the led is more susceptible to mechanical stress. therefore, pcb must be allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) avago technologies led configuration ingan device cathode note: electrical connection between bottom surface of led die and the lead frame material through conductive paste of solder. ? over sizing of plated through hole can lead to twisting or improper led placement during auto insertion. under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. note: refer to application note an1027 for more information on soldering led components. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: precautions: lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced into the led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? the closest manual soldering distance of the soldering heat source (soldering iron s tip) to the body is 1.59 mm. soldering the led closer than 1.59 mm might damage the led. ? recommended soldering conditions: manual solder wa ve soldering dipping pre-heat temperature 105 c max. C pre-heat time 30 sec max. C peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max. 1.59 mm ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to daily check on the soldering profile to ensure that the soldering profile is always conforming to recommended soldering condition. notes: 1. pcb with different size and design (component density) will have different head mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to recalibrate the soldering profile again before loading a new type of pcb. 2. avago technologies' high brightness led are using high efficiency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250 c. overstressing the led during soldering process might cause premature failure to the led due to delamination.
laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time ?seconds temperature ? c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c 5 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 lead solder: sn63; flux: rma lead free solder: 96.5% sn, 3.0% ag, 0.5% cu note: allow for boards to be sufficiently cooled before exerting mechanical force. recommended wave soldering profile ammo packs drawing 18.00 0.50 (0.7087 0.0197) 6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394) 9.125 0.625 (0.3593 0.0246) 12.70 0.30 (0.50 0.0118) cathode 0.70 0.20 (0.0276 0.0079) 20.50 1.00 (0.807 0.039) aa view a? ? 4.00 0.20 (0.1575 0.008) typ. all dimensions in millimeters (inches). 10
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries . data subject to change. copyright ? 2007 avago technologies limited. all rights reserved. obsoletes 5989-4125en av02-0214en april 2, 2007 packaging box ammo packs from left side of box, adhesive tape must be facing upward. avago technologies anode m o t h e r l a b e l cathode c a + anode lead leaves the box first. label on this side of box. note: for ingan device, the ammo pack packaging box contains esd logo. disclaimer avago s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.

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